Home-电脑和办公配件- Computer maintenance - TG-G3.0-01

Heatsink thermal paste grease, 3 g weight

TG-G3.0-01

Heatsink thermal paste grease, 3 g weight

TG-G3.0-01

Keep your computer's CPU cool
Practical syringe for easy application

Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive

Additional information

additional info TG-G series datasheet (1679 kb)

Weight: 3.0 g
Color: gray
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ° C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 ° C
Operating Temperature: -50 ~ 240 ° C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%

certificate (1440 kb)

CE Certificate (pdf file)

包装预览

artwork preview (485 kb)

高清图片

hi-res photo (3547 kb)

Web Site images

website image (206 kb)

website image (55 kb)

web package image (337 kb)

Packing details
装箱数量	100
外箱体积	0.041496
外箱重量	3.34
Individual package size LxWxH:	180x120x15 mm
Carton size LxWxH:	390x380x280 mm
原产国	CN
条码	8716309083133
Customs code	3402909000
Packaging	blister