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Heatsink thermal paste grease, 1.5 g weight

TG-G1.5-01

Heatsink thermal paste grease, 1.5 g weight

TG-G1.5-01

Keep your computer's CPU cool
Practical syringe for easy application

Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive

Informaçao adicional

additional info TG-G series datasheet (1679 kb)

Weight: 1.5 g
Color: grey
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ° C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 ° C
Operating Temperature: -50 ~ 240 ° C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%

CE certificate MSDS TG-GXX series thermal grease (1440 kb)

Pré-vizualizaçao embalagem

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Packing details
Quantidade por caixa, peças	100
Volume caixa, CUM	0.019602
Peso caixa, kgs	1.93
Tamanho embalagem individual CxLxA	150x60x20 mm
Tamanho caixa CxLxA	330x330x180 mm
País de origem	CN
Codigo de barras	8716309083126
Codigo alfandega	3402909000
Embalagem	blister