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Heatsink thermal paste grease, 1.5 g weight

TG-G1.5-01

Heatsink thermal paste grease, 1.5 g weight

TG-G1.5-01

Keep your computer's CPU cool
Practical syringe for easy application

Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive

Additional information

additional info TG-G series datasheet (1679 kb)

Weight: 1.5 g
Color: grey
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 ° C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 ° C
Operating Temperature: -50 ~ 240 ° C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%

CE certificate MSDS TG-GXX series thermal grease (1440 kb)

Package preview

artwork preview (289 kb)

Hi-Res photos

hi-res photo (1613 kb)

hi-res photo (2584 kb)

Web Site images

website image (173 kb)

web package image (296 kb)

Packing details
Q'ty in crtn, pcs	100
Crtn volume, CUM	0.019602
Crtn weight, kgs	1.93
Individual package size LxWxH:	150x60x20 mm
Carton size LxWxH:	330x330x180 mm
Country of origin	CN
Barcode	8716309083126
Customs code	3402909000
Packaging	blister